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DEIF TAC-311DG電流變送器

作者:xqt 發(fā)布時(shí)間:2022-07-06 15:08:40 次瀏覽

DEIF TAC-311DG電流變送器,TAC-311DG使用數據內存選項以下內存選項可用于不同版本的MVME172LX板。DRAM選項MVME172LX提供以下DRAM選項:4MB,8MB或16MB共享DRAM,在夾層上具有可編程奇偶校驗模塊上的4MB、8MB、16MB、32MB和64MB ECC DRAM夾層板。非ECC內存的DRAM架構對于4MB或8MB是非交叉的,對于16MB是交叉的。奇偶

DEIF TAC-311DG電流變送器,TAC-311DG使用數據

內存選項以下內存選項可用于不同版本的MVME172LX板。DRAM選項MVME172LX提供以下DRAM選項:4MB,8MB或16MB共享DRAM,在夾層上具有可編程奇偶校驗模塊上的4MB、8MB、16MB、32MB和64MB ECC DRAM夾層板。非ECC內存的DRAM架構對于4MB或8MB是非交叉的,對于16MB是交叉的。奇偶校驗保護當檢測到奇偶校驗錯誤時(shí),通過(guò)中斷或總線(xiàn)異常啟用。

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TAC-311DG(1).jpg

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DEIF TAC-311DG電流變送器DRAM性能在DRAM內存部分中指定MVME172 VME中MC2chip編程模型中的控制器嵌入式控制器程序員參考指南。DRAM映射解碼器可以編程以適應不同的夾層板的基址和尺寸。機載DRAM是通過(guò)本地總線(xiàn)重置禁用,并且必須在DRAM之前編程可以訪(fǎng)問(wèn)。請參閱中的MC2chip和MCECC說(shuō)明MVME172 VME嵌入式控制器程序員參考指南有關(guān)詳細的編程信息。大多數DRAM設備需要一定數量的訪(fǎng)問(wèn)周期,然后才能執行DRAM完全可以運行。通常,該要求由板載刷新電路和正常DRAM初始化。然而軟件應確保至少10個(gè)初始化周期對每個(gè)RAM組執行。SRAM選項MVME172LX提供128KB的32位寬板載靜態(tài)RAM在單個(gè)非交錯架構中,具有板載電池備份。這個(gè)SRAM陣列沒(méi)有奇偶校驗保護。車(chē)載SRAM和夾層的電池備份功能SRAM由電子營(yíng)銷(xiāo)EM1275設備(或等效),支持一次和二次電源。在如果主板電源出現故障,EM1275將檢查電源并切換到電壓較高的電源。如果備用電源的電壓低于兩伏,則EM1275阻止第二個(gè)存儲周期;這允許軟件提供早期警告以避免數據丟失。因為第二次訪(fǎng)問(wèn)可能被阻止在電源故障期間,軟件應在依靠數據。MVME172LX提供跳線(xiàn)(在J14上),允許任何一種電源將EM1275的電源連接到VMEbus+5V STDBY引腳或至車(chē)載電池的一個(gè)電池。例如,主系統備份電源可能是連接到VMEbus+5V STDBY引腳和輔助電源可能是車(chē)載電池。如果系統源如果出現故障或板從機箱中卸下,板載電池接管。

Memory Options

The following memory options are available on the different versions of

MVME172LX boards.

DRAM Options

The MVME172LX offers the following DRAM options: either 4MB,

8MB, or 16MB shared DRAM with programmable parity on a mezzanine

module, or 4MB, 8MB, 16MB, 32MB, and 64MB ECC DRAM on a

mezzanine board. The DRAM architecture for non-ECC memory is noninterleaved for 4MB or 8MB and interleaved for 16MB. Parity protection

is enabled with interrupts or bus exception when a parity error is detected.

DRAM performance is specified in the section on the DRAM Memory

Controller in the MC2chip Programming Model in the MVME172 VME

Embedded Controller Programmer’s Reference Guide.

The DRAM map decoder may be programmed to accommodate different

base address(es) and sizes of mezzanine boards. The onboard DRAM is

disabled by a local bus reset and must be programmed before the DRAM

may be accessed. Refer to the MC2chip and MCECC descriptions in the

MVME172 VME Embedded Controller Programmer’s Reference Guide

for detailed programming information.Most DRAM devices require a certain number of access cycles before the

DRAMs are fully operational. Normally this requirement is met by the

onboard refresh circuitry and normal DRAM initialization. However,

software should insure a minimum of 10 initialization cycles are

performed to each bank of RAM.

SRAM Options

The MVME172LX provides 128KB of 32-bit-wide onboard static RAM

in a single non-interleaved architecture with onboard battery backup. The

SRAM arrays are not parity protected.

The battery backup function for the onboard SRAM and the mezzanine

SRAM is provided by an Electro Marketing EM1275 device (or

equivalent) that supports primary and secondary power sources. In the

event of a main board power failure, the EM1275 checks power sources

and switches to the source with the higher voltage.If the voltage of the backup source is lower than two volts, the EM1275

blocks the second memory cycle; this allows software to provide an early

warning to avoid data loss. Because the second access may be blocked

during a power failure, software should do at least two accesses before

relying on the data.

The MVME172LX provides jumpers (on J14) that allow either power

source of the EM1275 to be connected to the VMEbus +5V STDBY pin or


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