DEIF PCM4.3船舶模塊，PCM4.3使用產(chǎn)品
高溫操作的特殊注意事項以下信息適用于以下用戶(hù)：MVME172LX可能會(huì )經(jīng)受高溫。MVME172LX使用商業(yè)級設備。因此，它可以在環(huán)境空氣溫度為0°C至70°C的環(huán)境中操作C、 有幾個(gè)因素會(huì )影響部件的環(huán)境溫度在MVME172LX上。其中包括進(jìn)氣溫度；空氣流量特點(diǎn)；IP模塊的數量、類(lèi)型和位置；權力系統中相鄰板的損耗等。
DEIF PCM4.3船舶模塊MVME172-223的溫度分布是在MVME945 12插槽VME機箱。這塊板上有一個(gè)GreenSpring IP雙P/T模塊（位置a）和一個(gè)GreenSpring IP-488模塊（位置b）。一個(gè)25W負荷板安裝在每個(gè)負荷板附近測試板的側面。出口空氣速度約為200MVME172LX和IP雙P/T模塊之間的線(xiàn)性調頻。在下面在這些條件下，觀(guān)察到入口和出口空氣之間的溫度升高了10℃。在70°C出口空氣溫度（60°C進(jìn)口空氣）下計算MVME172LX上的設備（根據測量案例溫度），且不超過(guò)100℃。對于高溫操作，執行類(lèi)似操作測量和計算以確定實(shí)際特定環(huán)境的營(yíng)業(yè)利潤。EMC法規遵從性MVME172LX在符合EMC標準的機箱中進(jìn)行了測試，符合B類(lèi)設備的要求。合規性是根據以下條件：所有外部輸入/輸出端口上的屏蔽電纜。? 電纜屏蔽通過(guò)金屬外殼連接至底盤(pán)接地連接至導電模塊前面板的連接器。? 導電底盤(pán)導軌連接至底盤(pán)接地。這提供了將屏蔽連接到機箱接地的路徑。? 前面板螺釘正確擰緊。? 所有外圍設備均符合EMC標準。對于最小射頻發(fā)射，必須滿(mǎn)足上述條件已實(shí)施。如果不這樣做，可能會(huì )影響FCC的合規性包含模塊的設備。MVME172LX是一種板級產(chǎn)品，用于標準VME應用程序。因此，OEM有責任符合其應用確定的監管準則。所有外部輸入/輸出連接器都經(jīng)過(guò)屏蔽，以幫助滿(mǎn)足EMC排放要求標準。MVME172LX板在EMC的MCG機箱中進(jìn)行了測試
Special Considerations for Elevated-Temperature Operation
The following information is for users whose applications for the
MVME172LX may subject it to high temperatures.
The MVME172LX uses commercial-grade devices. Therefore, it can
operate in an environment with ambient air temperatures from 0° C to 70°
C. Several factors influence the ambient temperature seen by components
on the MVME172LX. Among them are inlet air temperature; air flow
characteristics; number, types, and locations of IP modules; power
dissipation of adjacent boards in the system, etc.
A temperature profile of the MVME172-223 was developed in an
MVME945 12-slot VME chassis. This board was loaded with one
GreenSpring IP-Dual P/T module (position a) and one GreenSpring IP-488
module (position b). One 25W load board was installed adjacent to each
side of the board under test. The exit air velocity was approximately 200
LFM between the MVME172LX and the IP-Dual P/T module. Under
these conditions, a 10° C rise between the inlet and exit air was observed.
At 70° C exit air temperature (60° C inlet air), the junction temperatures of
devices on the MVME172LX were calculated (from the measured case
temperatures) and did not exceed 100° C.
!
Caution
For elevated-temperature operation, perform similar
measurements and calculations to determine the actual
operating margin for your specific environment.EMC Regulatory Compliance
The MVME172LX was tested in an EMC-compliant chassis and meets the
requirements for Class B equipment. Compliance was achieved under the
following conditions:
? Shielded cables on all external I/O ports.
? Cable shields connected to chassis ground via metal shell
connectors bonded to a conductive module front panel.
? Conductive chassis rails connected to chassis ground. This provides
the path for connecting shields to chassis ground.
? Front panel screws properly tightened.
? All peripherals were EMC-compliant.
For minimum RF emissions, it is essential that the conditions above be
implemented. Failure to do so could compromise the FCC compliance of
the equipment containing the module.
The MVME172LX is a board-level product and meant to be used in
standard VME applications. As such, it is the responsibility of the OEM to
meet the regulatory guidelines as determined by its application.
All external I/O connectors are shielded to aid in meeting EMC emissions
standards. MVME172LX boards are tested in an MCG chassis for EMC
