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PM511V16 3BSE011181R1處理器單元模塊

作者:xqt 發(fā)布時(shí)間:2022-07-06 15:59:53 次瀏覽

PM511V16 3BSE011181R1處理器單元模塊,培訓教程是指定、設計和測試在進(jìn)氣溫度范圍內可靠運行0?至55?C(32?至131?F),強制空氣以一定速度冷卻通??赏ㄟ^(guò)使用100 CFM軸流風(fēng)機實(shí)現。溫度鑒定在標準摩托羅拉VME系統中進(jìn)行底盤(pán)。25瓦負載板插入兩個(gè)卡槽,每側一個(gè),靠近測試板,以模擬高功率密度系統配置。三軸組件每個(gè)風(fēng)機的額定功率為100 CFM的風(fēng)機直接放置在VME下方卡片

PM511V16 3BSE011181R1處理器單元模塊,培訓教程是指定、設計和測試在進(jìn)氣溫度范圍內可靠運行0?至55?C(32?至131?F),強制空氣以一定速度冷卻通??赏ㄟ^(guò)使用100 CFM軸流風(fēng)機實(shí)現。溫度鑒定在標準摩托羅拉VME系統中進(jìn)行底盤(pán)。25瓦負載板插入兩個(gè)卡槽,每側一個(gè),靠近測試板,以模擬高功率密度系統配置。三軸組件每個(gè)風(fēng)機的額定功率為100 CFM的風(fēng)機直接放置在VME下方卡片固定框架。

PM511V16 3BSE011181R1 -3.jpg

PM511V16 3BSE011181R1 -2.jpg

PM511V16 3BSE011181R1 -1.jpg

PM511V16 3BSE011181R1處理器單元模塊進(jìn)氣溫度是在風(fēng)機組件和卡籠,其中首先進(jìn)入氣流遇到被測模塊。測試軟件作為模塊受到環(huán)境溫度變化的影響。案例關(guān)鍵的高功率密度集成電路的溫度是監控以確保組件供應商規范超過(guò)。而冷卻所需的確切風(fēng)量取決于:? 環(huán)境空氣溫度? 電路板類(lèi)型? 電路板數量? 配電盤(pán)的位置? 其他熱源通常使用10 CFM和490可以實(shí)現充分冷卻流經(jīng)模塊的線(xiàn)性調頻。需要更少的氣流來(lái)冷卻具有較低最大環(huán)境的環(huán)境中的模塊。在更有利的熱條件下,可以運行模塊在高于55?C的溫度下可靠運行,氣流增加。它重要的是要注意,除了空氣動(dòng)器的額定CFM,決定實(shí)際體積以及流經(jīng)模塊的空氣速度。Atlas主板需要強制風(fēng)冷。安裝MPC604時(shí)需要額外冷卻RISC處理器。3針收割臺(J17)安裝在為專(zhuān)用風(fēng)扇供電的主板。參見(jiàn)冷卻一般信息一章中的要求部分溫度

The Motorola MVME177 VMEmodule is specified, designed, and

tested to operate reliably with an incoming air temperature range

from 0? to 55? C (32? to 131? F) with forced air cooling at a velocity

typically achievable by using a 100 CFM axial fan. Temperature

qualification is performed in a standard Motorola VMEsystem

chassis. Twenty-five watt load boards are inserted in two card slots,

one on each side, adjacent to the board under test, to simulate a high

power density system configuration. An assembly of three axial

fans, rated at 100 CFM per fan, is placed directly under the VME

card cage. The incoming air temperature is measured between the

fan assembly and the card cage, where the incoming airstream first

encounters the module under test. Test software is executed as the

module is subjected to ambient temperature variations. Case

temperatures of critical, high power density integrated circuits are

monitored to ensure component vendors specifications are not

exceeded.

While the exact amount of airflow required for cooling depends on:

? Ambient air temperature

? Type of board

? Number of boards

? Location of boards

? Other heat sources

adequate cooling can usually be achieved with 10 CFM and 490

LFM flowing over the module. Less airflow is required to cool the

module in environments having lower maximum ambients. Under more favorable thermal conditions, it may be possible to operate

the module reliably at higher than 55? C with increased airflow. It

is important to note that there are several factors, in addition to the

rated CFM of the air mover, which determine the actual volume

and speed of air flowing over a module.

Forced air cooling is required for the Atlas motherboard.

Additional cooling is required with the installation of the MPC604

RISC processor. A 3-pin header (J17) is provided on the

motherboard for powering a dedicated fan. Refer to the Cooling

Requirements section in the General Information chapter for

temperatur


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