Tokyo Electron 3D80-000710-V3冷卻機組件 PDF資料
1.產(chǎn) 品 資 料 介 紹：
中文資料：
Tokyo Electron 3D80-000710-V3 冷卻機組件 是用于半導體制造設備中的關(guān)鍵熱管理單元，其主要功能是對設備內部產(chǎn)生的熱量進(jìn)行有效控制和散熱，保障系統在高精度、高負載運行下的穩定性和性能。以下是其產(chǎn)品應用領(lǐng)域的詳細分析：
一、主要應用領(lǐng)域
半導體蝕刻設備（Etching Systems）
冷卻機組件用于控制反應腔溫度，防止等離子體處理過(guò)程中產(chǎn)生過(guò)熱現象。
確保工藝氣體反應的溫控精度，提高蝕刻圖形一致性。
化學(xué)氣相沉積系統（CVD, PECVD, SACVD 等）
在薄膜沉積過(guò)程中冷卻反應腔體、基板傳送系統、真空泵等關(guān)鍵子系統。
控制熱負荷以提升膜厚均勻性與成膜質(zhì)量。
光刻設備（Lithography Equipment）
用于冷卻曝光系統的光源模塊或曝光臺底板，保障曝光精度。
在高重復頻率操作中維持系統熱穩定性，降低熱漂移誤差。
晶圓傳送與對準模塊（Wafer Transfer & Alignment Systems）
對馬達驅動(dòng)部件或傳送機械臂提供冷卻，延長(cháng)設備使用壽命。
保持恒溫狀態(tài)，提高晶圓對準精度與機械響應速度。
真空泵及冷卻循環(huán)系統
與工藝泵系統耦合，作為制程運行中輔助熱管理單元。
控制真空腔體內的溫度，提升抽氣系統效率。
英文資料：
The Tokyo Electron 3D80-000710-V3 cooling unit is a critical thermal management unit used in semiconductor manufacturing equipment. Its main function is to effectively control and dissipate the heat generated inside the equipment, ensuring the stability and performance of the system under high-precision and high load operation. The following is a detailed analysis of its product application areas:
1、 Main application areas
Semiconductor Etching Systems
The cooling machine component is used to control the temperature of the reaction chamber and prevent overheating during plasma processing.
Ensure the temperature control accuracy of process gas reaction and improve the consistency of etching patterns.
Chemical vapor deposition systems (CVD, PECVD, SACVD, etc.)
During the thin film deposition process, key subsystems such as the cooling reaction chamber, substrate transfer system, and vacuum pump are cooled.
Control heat load to improve film thickness uniformity and film quality.
Lithography Equipment
Used to cool the light source module or exposure stage substrate of the exposure system, ensuring exposure accuracy.
Maintain system thermal stability and reduce thermal drift errors during high repetition rate operations.
Wafer Transfer&Alignment Systems
Provide cooling for motor driven components or conveying robotic arms to extend equipment lifespan.
Maintain a constant temperature to improve wafer alignment accuracy and mechanical response speed.
Vacuum pump and cooling circulation system
Coupled with the process pump system, serving as an auxiliary thermal management unit during process operation.
Control the temperature inside the vacuum chamber to improve the efficiency of the pumping system.
2.產(chǎn) 品 展 示
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